Volunteer List

The ESD Association is served by many volunteers who offer their expertise and dedication. Here is a list of the Association's volunteers and the committees/groups on which they serve.

Kay Adams , Tech Wear, Inc., Carlsbad, CA

WG 2

Thomas Albano, ITT Space Systems Division, Rochester, NY

WG 2, WG 10, STDCOM

Warren Anderson, AMD, Boxborough, MA

Technical Program Committee, IEW Committee

Robert Ashton, ON Semiconductor, Phoenix, AZ

Technical Program Committee, WG 5.1, WG 5.2, WG 5.3.1, WG 5.4, WG 5.5, WG 5.6, WG 14

Jon Barth, Barth Electronics, Inc., Boulder, NV

WG 5.2, WG 5.3.1, WG 5.5, WG 5.6, WG 14, Technical Program Committee

Brent Beamer, 3M, Sanford, NC

STDCOM, WG 1, WG 4, WG7, WG 9, WG 11

Donn Bellmore, Advanced ESD Services +, Binghamton, NY

ESDA Board of Directors, President, EXCOM, Marketing & Communications, STDCOM, Human Resources, Education, Technical Program Committee, WG 2, WG 3, WG 10

Donald Boehm, Dou Yee Enterprises, Truckee, CA

Human Resources, STDCOM, WG 1, WG 2, WG 10, WG 11

Gianluca Boselli, Texas Instruments, Inc., Dallas, TX

Symposium Business Unit Manager, Steering Committee, Technical Program Committee, ESDA Board of Directors, Device Design Chair, Education Council, IEW Committee

Aniket Breed, Intel Corp., Folsom, CA

WG 5.6

Laurie Casselman, QRP, Inc., Tucson, AZ

WG 15

Lorenzo Cerati, STMicroelectronics, AgrateBrianza, Italy

Technical Program Committee, IEW Committee, WG 14, WG 5.1, WG 5.3.1, WG 5.4, WG 5.6

Mike Chaine, Micron Technology, Inc., Boise, ID

STDCOM, WG 5.1, WG 5.2, WG 5.3.1, WG 5.5, Technical Program Committee

Gene Chase, Electro-Tech Systems, Inc., Granite Falls, NC

STDCOM, WG 1, WG 15, WG 16, WG 53, WG97

Cheryl Checketts, General Dynamics, Scottsdale, AZ

Human Resources, STDCOM, Steering Committee, WG 1, WG 13, WG 16, WG 53

Mauro Ciappa

IEW Committee

Paolo Colombo, STMicroelectronics, Milano, Italy

Technical Program Committee

Ann Concannon, National Semiconductor Corp., Santa Clara, CA

Technical Program Committee

Ted Dangelmayer, Dangelmayer Associates, Annisquam, MA

Human Resources, Education, STDCOM, Technical Program Committee

Marcel Dekker, Master Engineering BV, Enschede, The Netherlands

WG 5.1, WG 5.2, WG 5.3.1, WG 5.4, WG 5.5, WG 5.6

Rejean Dion, Bystat International, Inc., St. Laurent, QC, Canada

WG 2, WG 7, WG 10

Kevin Duncan, Seagate Technology, Bloomington, MN

TAS, STDCOM, WG 3, WG 5.6, WG 9, WG 13

Jeff Dunnihoo, NPX Semiconductors, Bertram, TX

WG 14

Charvaka Duvvury, Texas Instruments, Dallas, TX

ESDA Board of Directors, Human Resources, Education, Technical Liaison Team, Awards Committee, IEW Committee

Kurt Edwards, Lubrizol Conductive Polymers, Chino Hills, CA
WG 1, WG2, WG11, WG 13, STDCOM

David Eppes, AMD, Austin, TX
Technical Program Committee

Kai Esmark, Infineon Technologies, Munich, Germany

Technical Liaison Team, Technical Program Committee

Melanie Etherton, Freescale Semiconductor, Austin, TX

Technical Program Committee, IEW Committee

Mark Fancourt, Lehigh Safety Shoe Co., Nelsonville, OH

WG 9

Marti Farris, Intel Corporation, Hillsboro, OR

WG 5.1, WG 5.2, WG 5.3.1, WG 5.4

Melissa Feeney-Jolliff, Aerospace Corporation, Hawthorne, CA

STDCOM, WG 16, WG 53

Eugene Felder, Desco Industries, Inc., Laguna Beach, CA

WG 1, WG 2, WG 3, WG 13, WG 16, WG 53

Steve Fowler, Fowler Associates, Inc., Moore, SC

WG 97

Yasuhiro Fukido, OKI Electronics

Technical Program Committee

Reinhold Gaertner, Infineon Technologies, Neubiberg, Germany

WG 5.1, WG 5.2, WG 5.3.1, Technical Program Committee

Robert Gauthier, IBM, Essex Junction, VT

Symposium Vice General Chair, Steering Committee, IEW Committee, ESDA Board of Directors, EXCOM

Ron Gibson, Celestica, Toronto, ON, Canada

Technical Program Committee

Horst Gieser, Fraunhofer IZM, Munich, Germany

IEW Committee, WG 5.1, WG 5.2, WG 5.3.1, WG 5.4, WG 5.5, WG 5.6, WG 14

Harald Gossner, Infineon Technologies, Neubiberg, Germany

IEW Committee

Chai Gill, Freescale Semiconductors, Tempe, AZ

Technical Program Committee

William Greason, University of Western Ontario, London, ON, Canada

Technical Program Committee

Alessio Griffoni, IMEC & University of Padova, Padova, Italy

Technical Program Committee

Dale Gross, Flexco, Gresham, OR

WG 7

Vaughn Gross, Green Mountain ESD Labs, Inc., St. Albans, VT

STDCOM, WG 5.1, WG 5.2, WG 5.3.1, WG 5.4, WG 5.5, WG 5.6, WG 97

Evan Grund, Grund Technical Solutions, LLC, San Jose, CA

STDCOM, TAS, WG 5.1, WG 5.2, WG 5.3.1, WG 5.4, WG 5.5, WG 5.6, WG 14, Technical Program Committee, IEW Committee

Bruno Guidotti, Forbo Flooring, Giubiasco, Switzerland

WG 7

Jay Hamlin, Medtronic, Tempe, AZ

STDCOM, WG 1, WG 2, WG 3, WG 10, WG 11, WG 15, WG 16, WG 53

Ginger Hansel, Dangelmayer Associates LLC, Austin, TX

ESDA Board of Directors, Education Business Unit Manager, Technical Program Committee, IEW Committee

Leo G. Henry, ESD & TLP Consultants, Freemont, CA

ESDA Board of Directors, Sr. Vice President, EXCOM, TAS, Education, STDCOM, Technical Liaison Team, WG 5.1, WG 5.2, WG 5.3.1, WG 5.4, WG 5.5, WG 5.6, WG 14, Education Council, Marketing & Communications, Technical Program Committee, Human Resources, IEW Committee

Marcos Hernandez, Thermo Fisher Scientific, Lowell, MA

WG 5.6

Steve Heymann, MKS, Ion Systems, Alameda, CA

STDCOM, WG 3, WG 10, WG 17

Mike Hopkins, Amber Precision Instruments, Hollis, NH

STDCOM, WG 5.1, WG 5.2, WG 5.3.1, WG 5.5, WG 5.6, WG 14, Technical Program Committee

Tim Iben, IBM, San Jose, CA

Technical Program Committee

Hiroyasu Ishizuka, Renasas Technology Corporation, Tokyo, Japan

Technical Program Committee, IEW Committtee

Satoshi Isofuku, Tokyo Electronics Trading Co., Ltd., Tokyo, Japan

WG 5.2, WG 5.3.1

Vsevold Ivanov, Dell, Inc., Round Rock, TX

WG 14

Tim Jarrett, Boston Scientific, St. Paul, MN

WG 17

Guillaume Jenicot, ON Semiconductor

IEW Committtee

Yan Kep Pen, Infineon, Malaysia

Technical Program Committee

Bart Keppens, SOFICS, Gistel, Belgium

Technical Program Committee

Michael Khazhinsky, Freescale Semiconductor, Inc, Austin, TX

Steering Committee, Technical Program Committee Chair

John Kinnear, IBM, Poughkeepsie, NY

ESDA Board of Directors, TAS, Marketing & Communications, STDCOM, Facility Certification Business Unit Manager, Awards Committee, WG 9, WG 7, WG 17, Technical Program Committee

Vladimir Kraz, 3M, Soquel, CA

WG 3, WG 10, WG 17, Technical Program Committee

James Krzmarzick, SAIC / NASA, Houston, TX

WG 3, WG 13, WG 53

Hans Kunz, Texas Instruments, Dallas, TX

Technical Program Committee, Steering Committee

Raivo Leeto, Sandia National Laboratories, Albuquerque, NM

Steering Committee

JunJun Li, IBM, Essex Junction, VT
Technical Program Committee

Dimitri Linten, IMECvzw Belgium, Leuven, Belgium
IEW Committee

Leo Luquette, Cypress Semiconductors, Colorado Springs, CO

WG 5.2, WG 5.3.1, WG 5.4, WG 5.5, WG 5.6, WG 14

Natarajan Mahadeva Iyer, GLOBALFOUNDRIES, Singapore
IEW Committee, Technical Program Committee

Tim Maloney, Intel Corporation, Santa Clara, CA

WG 5.5, WG 14, Awards Committee, Technical Program Committee, IEW Committee

Gaudenzio Meneghesso, University of Padova-DEI, Padova, Italy

Technical Program Committee, IEW Committee

Markus Mergens, Infineon Technologies, Neubiberg, Germany

IEW Committee, Technical Program Committee

Tom Meuse, Thermo Fisher Scientific, Lowell, MA

WG 5.1, WG 5.2, WG 5.3.1, WG 5.4, WG 5.5, WG 14, STDCOM

Doug Miller, Sandia National Laboratories, Amarillo, TX

WG 5.2

Jim Miller, Freescale Semiconductor, Austin, TX

Technical Program, IEW Committee

Thomas Miller, Pace Worldwide, Annapolis Junction, MD

WG 5.6, WG 13

Kyungjin Min, Amber Precision Instruments , Santa Clara, CA

WG 5.1, WG 5.2, WG 5.3.1, WG 14

Souvick Mitra, IBM, Essex Junction, VT

Technical Program Committee

Thomas Mohler, Raytheon TI Systems, Dallas, TX

WG 97

Kathy Muhonen, Penn State Behrend, Erie, PA

ESDA Board of Directors, Education, WG 5.1, WG 5.2, WG 5.3.1, WG 5.4, WG 5.5, WG 5.6, WG 14

Andy Murello, Cocoa, FL

Steering Committee

Ravindra Narayan, Milpitas, CA

WG 5.2

Carl Newberg, River’s Edge Technical Services/MicroStat Labs, Rochester, MN

ESDA Board of Directors, Education Council, Education, Standards Business Unit Manager, STDCOM Chair

Nicolas Nolhier, LAAS/CRNS, Toulouse, France

Technical Program Committee, IEW Committee

Guido Notermans, NXP Semiconductors, Zurich, Switzerland

Technical Program Committee, IEW Committee

Takayoshi Ohtsu, Hitachi Global Storage Tech, Kanagawa, Japan

Technical Program Committee

Elaine Olson, Intel Corporation, Chandler, AZ

WG 2, WG 11, WG 15

Joseph Parent, Intel Corporation, Hillsboro, OR

WG 14

Dale Parkin, Seagate Technology, Shakopee, MN

STDCOM, WG 2, WG 3, WG 4, WG 9, WG 11, WG 17, WG 97, Human Resources

Nathaniel Peachey, RF Micro Devices, Greensboro, NC

ESDA Board of Directors, Education, Advanced Topics Business Unit Manager, STDCOM, Technical Program Committee, TAS, WG 5.1, WG 5.2, WG 5.3.1, WG 5.4, WG 5.5, WG 5.6, WG 14

Tom Pelc, SUN, Newark, CA

WG 53

Roger Peirce, SIMCO Electronics, Hatfield, PA

WG 17

Allan Peters, EJ Footwear Corp., Vestal, NY

WG 97

Paul Peterson, 3M Canada, Inc., London, Ontario

WG 97

Rainer Pfeifle, Wolfgang Wambier, Hilzingen, Germany

Technical Program Committee

Dionyz Pogany, Vienna University, Vienna, Austria

Technical Program Committee, IEW Committee

Claude "Bubba" Powers, Cooper Hand Tools-Weller Division, Apex, NC WG 13

Tim Prass, Raytheon, Indianapolis, IN

ESDA Board of Directors, Program Manager Chair, Education, STDCOM, WG 3 ,WG 11, WG 13, WG 15, WG 16, WG 17, WG 53

Donn Pritchard, Monroe Electronics, Lyndonville, NY

ESDA Board of Directors, EXCOM, Marketing & Communications, STDCOM, Steering Committee, WG 3, WG 10, Human Resources Business Unit Manager

Brian Retzlaff, Plexus, Neenah, WI

WG 16, WG 53

Bill Ricker, Ricker Engineering Services, San Marcos, TX

WG 16

Alan Righter, Analog Devices, Wilmington, MA

STDCOM, WG 5.1, WG 5.2, WG 5.3.1, WG 5.4, WG 5.5, WG 5.6, WG14, Technical Program Committee

Elyse Rosenbaum, University of Illinois, Urbana, IL

Technical Program Committee

Martin Rudat, Invista Corporation, Kennesaw, GA

WG 97

Christian Russ, Infineon Technology, Munich, Germany

Technical Program Committee

Jeff Salisbury, Flextronics, Austin, TX

STDCOM, WG1, WG 3, WG 10, WG 11, WG 16

Akram Salman, Advanced Micro Devices, Sunnyvale, CA

Technical Program Committee

Jose Sancho, NASA/GSFC Honeywell TSI, Greenbelt, MD

WG 13, WG 16, WG 53, STDCOM

Sandeep Sangameswaran, IMEC vzw Belgium, Leuven, Belgium

Technical Program Committee

Masonori Sawada, Hanwa Electric Ind. Co., Ltd., Wakayama, Japan

WG 5.1, WG 5.2, WG 5.3.1, WG 5.4, WG 5.5, WG 14

Mirko Scholz, IMECvzw, Leuven, Belgium

WG 5.1, WG 5.2, WG 5.3.1, WG 5.4, WG 5.5, WG 5.6, WG 14

Karen Shrier, Electronic Polymers, Inc., Round Rock, TX

WG 5.3.1, WG 5.4, WG 5.6, WG 14

Jeremy Smallwood, Electrostatic Solutions , Hampshire, Great Britian

Technical Program Committee

Theo Smedes, NXP Semiconductors, Nijmegen, The Netherlands

Technical Program Committee

Doug Smith, D.C. Smith Consultants, Los Gatos, CA

WG 14, Technical Program Committee

Wolfgang Stadler, Infineon Technologies, Munich, Germany

WG 5.4, WG 5.5, WG 5.6, WG 14, Technical Program Committee, IEW Committee

Arnie Steinman, Electronics Workshop, Berkeley, CA

STDCOM, WG 3, WG 10, WG 17

Don Stella, Iron Age Corp., Crafton, PA

WG 97

Michael Stockinger, Freescale Semiconductor, Austin, TX

Technical Program Committee

Teruo Suzuki, Fujitsu VLSI Limited, Kasugai-shi, Aichi, Japan

IEW Committee

David Swenson, Affinity Static Control Consulting, LLC, Round Rock, TX

ESDA Board of Directors, Past-President, EXCOM, TAS, Human Resources, Education, Marketing & Communications Business Unit Manager, Awards Committee, STDCOM, Technical Liaison Team, WG 2, WG 3, WG 10, WG 17

Howard Tang, UMC, Hsin-Chu City, Taiwan

IEW Committee

Augusto Tazzoli, University of Padova, Padova, Italy

Technical Program Committee, IEW Committee

Fred Tenzer, Desco Industries, Inc., Stow, OH

TAS Chair, STDCOM

Steven Thijs, IMEC vzw, Leuven, Belgium

Technical Program Committee

Dale Tucker, Floorfolio/Responsive Flooring, Atlanta, GA

WG 7, WG 97

Julius Turangan, Ovation Inc., Livermore, CA

STDCOM, WG 2, WG 3, WG 10, WG 11, WG 15

Hans Van Zwol, NXP Semiconductors, Nijmegen, The Netherlands

WG 5.6, Technical Program Committee

Vladislav Vashchenko, Nat'l Semiconductor Corp, Santa Clara, CA

Technical Program Committee, IEW Committee

Vesselin Vassilev, Novorell Technologies, Dallas, TX

Technical Program Committee, Symposium General Chair, Steering Committee

Bob Vermillion, RMV Technology Group, LLC, Moffettfield, CA

Human Resources, STDCOM, WG 4, WG 11, WG 13, WG 15

Toni Viheriakoski, Cascade Metrology, Lohja, Finland

Technical Program Committee

Steve Voldman, Intersil Corporation, South Burlington, VT

ESDA Board of Directors, STDCOM, Education, Marketing & Communications, Technical Liaison Team, Steering Committee, Technical Program Committee, WG 5.1, WG 5.2, WG 5.3.1, WG 5.4, WG 5.5, WG 5.6, WG 14

Albert Wallash, Hitachi GST, San Jose, CA

Technical Program Committee, IEW Committee

Scott Ward, Texas Instruments, Dallas, TX

WG 5.1, WG 5.2, WG 5.3.1, WG 5.4, WG 5.5, WG 5.6, WG 14

Stan Weitz, Electro-Tech Systems, Inc., Glenside, PA

WG 11, WG 15

Terry Welsher, Dangelmayer Associates, Suwanee, GA

ESDA Board of Directors,Vice President, EXCOM, Education Committee, Technical Liason Team, Marketing & Communications, Education Council, WG 5.1, WG 5.2, WG 5.3.1, WG 17

Heinrich Wolf, Fraunhofer IZM, Munich, Germany

Technical Program Committee, IEW Committee

Craig Zander, Prostat Corporation, Edina, MN

STDCOM, WG 11

Thomas Zhang, Hyperion Catalysis International, Cambridge, MA

WG 11